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Copperclad FR4 PCB Substrates

Specifications

  • Fully annealed electrolytic copper foil (Grade 3 HTE)
    • Available cladding:
      • half-ounce: 0.00065 in. (0.017mm)
      • one-ounce: 0.0013 in. (0.033mm)
  • Substrate: modified tetra-functional epoxy resin
    • Tg = 140C
    • Thickness: 0.059 in. (1.50mm)
  • Full specifications

Benefits

  • AOI compatible
  • UV stabilized
  • High-temperature extrusion resistant
  • Superior performance through multiple thermal excursions
  • Consistent impedance

Uses

  • Printed Circuit Board (PCB) fabrication

Shipping

  • Substrate sizes require the use of "dimensional weight" for shipping calculations
    • 9 in. X 12 in. single sheets - 2 lb. dim.
    • 9 in. X 12 in. 5-packs - 3 lb. dim.
    • 12 in. X 18 in. single sheets - 5 lb. dim.
    • 12 in. X 18 in. 5-packs - 5 lb. dim.
Copperclad
Loose
Sheets
Multi-sheet
Packs
Backing
Materials
Entry
Foil

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Contact Customer Support for more information.

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Updated 10/10/2016 12:25:16 PM